Semiconductor device

Details Semiconductor device Semiconductor device

1990-01-22

1990-10-16

James, Andrew J.

357 70, 357 72, 357 55, H01L 2302

Patent

active

049639757

ABSTRACT:
A semiconductor device includes a semiconductor chip, a heat radiation plate having a mounting portion on which the semiconductor chip is mounted, lead terminals connected to the semiconductor chip, a mold resin for sealing the semiconductor chip and parts of the lead terminals in cooperation with the heat radiation plate. The semiconductor device further includes cutput portions for interrupting a stress applied to the semiconductor chip.

REFERENCES:
patent: 4791472 (1988-12-01), Okikawa et al.

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