Semiconductor devices

Details Semiconductor devices Semiconductor devices

1994-02-02

1995-02-28

Ledynh, Bot

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 522, 361709, 361736, 257690, 257695, 257706, 257707, 257787, 257796, H05K 720, H01L 2328

Patent

active

053942981

ABSTRACT:
A semiconductor device comprises a semiconductor chip carrier and a semiconductor chip packaged therein with a resin. The semiconductor chip carrier comprises a printed wiring substrate with conductor patterns, a first adhesive layer formed on at least an outer peripheral portion of the substrate, a second adhesive layer formed on the conductor pattern of the substrate, a lead frame joined to the substrate through the adhesive layers and comprised of plural leads for external connection. The conductor pattern is electrically connected to a part of inner leads of the lead frame.

REFERENCES:
patent: 5012386 (1991-04-01), McShane et al.
patent: 5332864 (1994-07-01), Liang et al.

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