Rapid annealing under high pressure for use in fabrication of se

Fishing – trapping – and vermin destroying

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148DIG4, H01L 21324

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048450553

ABSTRACT:
For preventing a semiconductor substrate from a heat attack, a method of rapid annealing using a lamp unit for a heat radiation comprises the step of preparing a semiconductor substrate having a multiple-layer structure and a vessel having an annealing chamber where the lamp unit is placed, the vessel is associated with an inert gas supplying system operative to supply a high-pressure inert gas to the annealing chamber, and the above step is followed by the steps of placing the semiconductor substrate in the annealing chamber, supplying the high-pressure inert gas to the annealing chamber so as to create a high-pressure inert ambient within a predetermined range and activating the lamp unit for the heat radiation so as to heat up the semiconductor substrate, so that the heat radiation is decreased in intensity by virtue of the high-pressure inert ambient.

REFERENCES:
patent: 4566913 (1986-01-01), Brodsky et al.
patent: 4567058 (1986-01-01), Koh
patent: 4752592 (1988-06-01), Tamura et al.
Ho et al., "Characterization of Rapidly Annealed MO-Polycide", J. Vac. Sci. Technol. A3(3) (May/Jun. 1985), pp. 896-899.

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