Misregistration fidutial

Metal working – Method of mechanical manufacture – Electrical device making

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29832, H05K 330

Patent

active

061159107

ABSTRACT:
A misregistration fidutial structure and method for verifying registration between multiple layers of multi-layer subassembly for an electronic device. A substrate for the subassembly is provided, where a first layer, typically having electrically conductive signal paths, is placed over the substrate. A second layer, typically a soldermask, is placed over the first layer. An aperture is formed in the second layer a predetermined horizontal distance from a conductive signal path in the underlying first layer so that through visual observation one can easily determine whether misregistration is present when any portion of the underlying signal conductive path is observable through the second layer aperture.

REFERENCES:
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patent: 5385289 (1995-01-01), Bloch et al.
patent: 5517756 (1996-05-01), Shirai et al.
patent: 5518964 (1996-05-01), DiStefano et al.
patent: 5710063 (1998-01-01), Forehand et al.
patent: 5723205 (1998-03-01), Millette et al.
patent: 5724232 (1998-03-01), Bhatt et al.

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