Optical transmission package

Details Optical transmission package Optical transmission package

1987-04-22

1989-07-04

Sikes, William L.

350 9615, 350 9617, G02B 636

Patent

active

048445819

ABSTRACT:
An injection laser package having a housing and an optical fiber pigtail extending onto a sub-mount of a mount with the sub-mount being formed of a plurality of thick film layers which incorporate a resistance heating element and etched conductors which are insulated from a narrow solder pad. With the end portion of the fiber in alignment with the injection laser chip, a current is applied to the conductors to heat the sub-mount and melt the solder pad to thereby hold the fiber exactly in alignment with the chip. The portion of the fiber extending between the sub-mount and the inner end of the entrance support tube remains unsupported and thereby flexible so that external stresses on the package housing and, particularly, a support tube do not transfer any strain to the end portion of the fiber so that alignment with the injection laser chip is maintained.

REFERENCES:
patent: 4296998 (1981-10-01), Dufft
patent: 4585304 (1986-04-01), Winter et al.
patent: 4689659 (1987-08-01), Watanabe

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