Methods for and products having self-aligned conductive pillars

Details Methods for and products having self-aligned conductive pillars Methods for and products having self-aligned conductive pillars

1991-05-06

1992-07-21

James, Andrew J.

357 69, H01L 2348, H01L 2946, H01L 2954

Patent

active

051327759

ABSTRACT:
Methods, and products formed by such methods, of forming a self-aligned conductive pillar (16) on an interconnect (12) on a body (10) having semiconducting surfaces. A first mask (24) defines an inverse pattern for formation of an interconnect (12). The interconnect (12) is formed by additive metallization processes. A second mask (26) is formed over portions of the first mask (24) and the interconnect (12). Sidewalls of the first mask (24) which define at least one side of side of said interconnect (12) serve to also define at least one side of said conductive pillar (16). The second mask (26) also defines at least one side of the conductive pillar (16). The conductive pillar (16) is formed by additive metal deposition processes. The conductive pillar (16) is thus self-aligned to the interconnect (12) on which it is formed.

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