Heat resistant resin composition and adhesive sheet using the sa

Details Heat resistant resin composition and adhesive sheet using the sa Heat resistant resin composition and adhesive sheet using the sa

1997-09-29

1999-08-03

Gulakowski, Randy

Stock material or miscellaneous articles

Composite

Of epoxy ether

4284231, 525423, 525438, 525452, 525528, B32B 2738, C08F28304

Patent

active

059323515

ABSTRACT:
A heat resistant resin composition comprising (a) a polyamide-imide resin and (b) a thermosetting resin component, said composition giving a cured product having a storage elastic modulus at 300.degree. C. of 30 MPa or more, provides an adhesive sheet showing excellent solder heat resistance.

REFERENCES:
patent: 4316974 (1982-02-01), Ohmura et al.
patent: 5387652 (1995-02-01), Kawaki et al.
patent: 5750257 (1998-05-01), Doshita et al.
Encyclopedia of Science and Technology, vol. 6, pp. 350-351, 1986.
English Abstract of Japanese Patent Document No. 05-179220 (Jul. 1993).
English Abstract of Japanese Patent Document No. 62-151458 (Jul. 1987).
English Abstract of Japanese Patent Document No. 04-042521 (Feb. 1992).

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