Method and apparatus for mounting, inspecting and adjusting prob

Details Method and apparatus for mounting, inspecting and adjusting prob Method and apparatus for mounting, inspecting and adjusting prob

1995-03-13

1999-08-03

Cannon, James C.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

73 1R, 73 7, 738665, 324757, 324758, 324765, 428217, B32B 702, B32B 3300

Patent

active

059323230

ABSTRACT:
A method and apparatus for mounting, inspecting, and adjusting probe card needles used during testing of fabricated circuits. A build wafer, comprised of build and scrub target patterns, is used to mount and re-work probe needle assemblies onto a probe card. Each build target is composed of a hard material that is resistant to probe needle scratching, and is offset a preset distance from the position of the bonding pads on the actual wafer to be tested. Each scrub target is composed of a soft material that is easily disturbed by the probe needle's scrubbing action. By counting the number of lines broken or cut by a probe needle's scrub mark, the approximate length and width of the scrub mark may be ascertained. An adjustment tool is designed to fit snugly around the untapered, thickest portion of the probe needle. The tool is rotated along the axis of the probe needle shaft, allowing the technician to "tweak" the probe needle either up or down. In one embodiment, the tool consists of a three parallel cylinders, triangularly spaced, and attached orthogonally to the end of an offset lever. The spacing between the cylinders can accommodate the diameter of the thickest portion of a probe needle.

REFERENCES:
patent: 4583298 (1986-04-01), Raugh
patent: 4903523 (1990-02-01), Flynn
patent: 5321351 (1994-06-01), Swart et al.
patent: 5331275 (1994-07-01), Ozaki et al.
patent: 5436571 (1995-07-01), Karasawa
patent: 5479108 (1995-12-01), Cheng
patent: 5523697 (1996-06-01), Farnworth et al.

Affiliated with

Also associated with

Rating

Method and apparatus for mounting, inspecting and adjusting prob does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for mounting, inspecting and adjusting prob, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for mounting, inspecting and adjusting prob will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-848021