Resin-molded semiconductor device having heat radiating plate em

Details Resin-molded semiconductor device having heat radiating plate em Resin-molded semiconductor device having heat radiating plate em

1986-12-16

1988-06-07

Edlow, Martin H.

357 74, 357 81, 357 70, H01L 2328

Patent

active

047500301

ABSTRACT:
A lead frame has a plurality of metallic heat radiating plates, leads connected to each metallic heat radiating plate, other leads separated from the metallic heat radiating plates and a common insulator web attached to the metallic heat radiating plates. When the lead frame is placed in the cavity of a mold, the metallic heat radiating plates are correctly positioned in the mold cavity by the insulating web and the connected leads. By effecting a resin molding under this condition, the metallic heat radiating plates are molded in resin such that a layer of resin with a uniform thickness cover the back surface of the respective metallic heat radiating plates.

REFERENCES:
patent: 3423516 (1969-01-01), Segerson
patent: 3629672 (1971-12-01), Water
patent: 4503452 (1985-03-01), Yokozawa et al.
patent: 4507675 (1985-03-01), Fujii et al.

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