Master slice semiconductor device

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Details

357 51, 357 42, 357 40, H01L 2710, H01L 2702

Patent

active

047500271

ABSTRACT:
A master slice semiconductor device comprising a plurality of basic cell arrays and a plurality of flip-flop cell arrays. The basic cell and flip-flop cell arrays are interconnected by strip-like diffused resistor regions with metal conductors via contact windows formed in an insulation layer on a bulk. The basic cell arrays, the flip-flop cell arrays, and the diffused resistor regions are buried in the bulk in advance. The diffused resistor regions are located in empty regions where lands, composing the basic cell and flip-flop cell arrays, are not formed in the bulk.

REFERENCES:
patent: 3312871 (1967-04-01), Seki et al.
patent: 4161662 (1979-07-01), Malcolm et al.
patent: 4636831 (1987-01-01), One et al.
IEEE Transactions on Consumer Electronics, vol. Aug. 1980, pp. 201-210.

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