Method and apparatus for using pressure differentials through a

Details Method and apparatus for using pressure differentials through a Method and apparatus for using pressure differentials through a

1997-08-25

1999-08-03

Scherbel, David A.

Abrading

Abrading process

Glass or stone abrading

451287, 451288, 451504, 451505, 451 56, B24B 100

Patent

active

059317191

ABSTRACT:
Methods and apparatus for planarizing the surface of a semiconductor wafer by applying non-uniform pressure distributions to a polishing pad are disclosed. According to one aspect of the present invention, a chemical mechanical polishing apparatus for polishing a surface of a semiconductor wafer includes a polishing pad with a first surface and a second surface. The first surface of the polishing pad is arranged to contact the surface of the semiconductor wafer in order to polish the surface of the semiconductor wafer. The apparatus also includes a mechanism which is used to apply a non-uniform pressure distribution over the second surface of the polishing pad, wherein applying the non-uniform pressure distribution to the polishing pad facilitates evenly polishing the surface of the semiconductor wafer. In one embodiment, the mechanism for applying the non-uniform pressure distribution to the polishing pad is an air bladder arrangement.

REFERENCES:
patent: 1212628 (1917-01-01), Gowlland
patent: 4270316 (1981-06-01), Kramer et al.
patent: 4313284 (1982-02-01), Walsh
patent: 4918869 (1990-04-01), Kitta
patent: 4930264 (1990-06-01), Huang
patent: 5191738 (1993-03-01), Nakazato et al.
patent: 5423716 (1995-06-01), Strasbaugh
patent: 5441444 (1995-08-01), Nakajima
patent: 5541442 (1996-07-01), Keil et al.
patent: 5584746 (1996-12-01), Tanaka et al.
patent: 5597346 (1997-01-01), Hempel, Jr.
patent: 5605487 (1997-02-01), Hileman et al.
patent: 5605488 (1997-02-01), Ohashi et al.
patent: 5762539 (1998-06-01), Nakashiba et al.
patent: 5762546 (1998-06-01), James et al.
patent: 5800248 (1998-09-01), Pant et al.

Affiliated with

Also associated with

Rating

Method and apparatus for using pressure differentials through a does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for using pressure differentials through a , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for using pressure differentials through a will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-843646