Copper conductor paste and production method of copper conductor

Details Copper conductor paste and production method of copper conductor Copper conductor paste and production method of copper conductor

1995-12-08

1998-09-15

Kopec, Mark

Compositions

Electrically conductive or emissive compositions

Free metal containing

25251933, 106 113, H01B 120, H01B 122

Patent

active

058075089

ABSTRACT:
A conductor paste comprising a high-polymer composite obtained by dispersing super-fine-granulated copper oxide in a polymer without being aggregated, mixed copper powders mainly composed of a base copper powder having a mean particle size of 1 to 10 .mu.m added with at least one kind of an auxiliary copper powder having a mean particle size smaller than that of the base copper powder, and an organic solvent, wherein the wight ratio of the mixed copper powders to copper oxide in the high-polymer composite is 5 to 50 to 1 of copper oxide and the total amount of copper oxide and the mixed copper powders is 50 to 90% by weight of the conductor paste, and a production method a conductor film by coating the conductor paste on the surface of a substrate and after pre-burning the conductor paste under temperature raising, burning the conductor paste to form the conductor film on the substrate.

REFERENCES:
patent: 4172919 (1979-10-01), Mitchell
patent: 4323483 (1982-04-01), Rellick
patent: 4877555 (1989-10-01), Yuhaku et al.
patent: 5261950 (1993-11-01), Morikawa et al.
Database WPI, Week 9246, AN 92-377154, Derwent Publications Ltd. JP 4277406 Feb. 10, 1992.
Database WPI, Week 9436, AN 94-288388, Derwent Publications Ltd. JP 6215617 May 8, 1994.
Abstract JP2189808, vol. 14, No. 463, Jul. 25, 1990.
Abstract JP1236513, vol. 13, No. 463, Sep. 21, 1989.
Abstract JP3049108, vol. 15, No. 187, Jul. 18, 1989.

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