Process for forming deposited film

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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437233, 437 531, H01L 21469

Patent

active

047175869

ABSTRACT:
A process for forming a deposited film comprises introducing into a film forming space for forming a deposited film on a substrate an activated species (A) formed by decomposition of a compound containing silicon and a halogen and an activated species (B) formed from a germanium containing compound for film formation which is chemically mutually reactive with said activated species (A) separately from each other, and then permitting the both species to react chemically with each other thereby to form a deposited film on the above substrate.

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patent: 4461783 (1984-07-01), Yamazaki
patent: 4521447 (1985-06-01), Oushinsky et al.
patent: 4522663 (1985-06-01), Oushinsky et al.
patent: 4569697 (1986-02-01), Tsu et al.
patent: 4582560 (1986-04-01), Sanjurjo

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