Method of connecting a semiconductor device to a wiring board

Details Method of connecting a semiconductor device to a wiring board Method of connecting a semiconductor device to a wiring board

1986-12-18

1988-06-07

Godici, Nicholas P.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

2281802, 156295, B23K 3100

Patent

active

047491205

ABSTRACT:
Method of connecting a semiconductor device to a wiring board in which electrical connection of metal bumps of a semiconductor device and wiring pattern of a wiring board is accomplished by pressure application between the bumps and wiring pattern, and mechanical fixing of the semiconductor device on the wiring board is accomplished by stiffened resin by use of which resin, the semiconductor device is fixed to the wiring board. By such separation of electrical connection and mechanical fixing, reliability of both function may be improved.

REFERENCES:
patent: 3486223 (1969-12-01), Butera
patent: 4208005 (1980-06-01), Nate et al.
patent: 4314870 (1982-02-01), Ishida et al.
patent: 4345371 (1982-08-01), Ohsawa et al.
patent: 4582975 (1986-04-01), Daughton

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