Resin encapsulated semiconductor device with heat radiator

Details Resin encapsulated semiconductor device with heat radiator Resin encapsulated semiconductor device with heat radiator

1990-10-17

1991-12-17

Hille, Rolf

357 80, H01L 2340, H01L 2312, H01L 2310

Patent

active

050738178

ABSTRACT:
A semiconductor device has a semiconductor chip, leads each having one end thereof connected to respective electrodes disposed on one surface of the semiconductor chip, heat radiation body disposed in contact with the other surface of the semiconductor chip, and a resin molding the semiconductor chip with the other ends of the leads and the heat radiation body exposed.

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