Multi-sublayer dielectric layers

Details Multi-sublayer dielectric layers Multi-sublayer dielectric layers

1990-07-02

1991-12-17

Carroll, J.

357 52, 357 71, H01L 2934, H01L 2348

Patent

active

050738143

ABSTRACT:
A dielectric layer comprising a plurality of sublayers of alternating composition can provide a reduced dielectric constant while providing the adhesion and laser drilling properties of a higher dielectric constant material. Such multi-sublayer dielectric layers may be formed in situ on a high density interconnect structure or may be laminated thereon after their own formation.

REFERENCES:
patent: 4827325 (1989-05-01), Orbach et al.
patent: 4933738 (1990-06-01), Orbach et al.
S. M. Sze, Semiconductor Devices Physics and Technology, John Wiley & Sons, New York (1985), pp. 344, 472.
An eight page data sheet entitled "Teflon AF Amorphous Fluoropolymer", dated 01/19/90 from DuPont.

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