Mechanical structure for mounting microwave diode packages

Wave transmission lines and networks – Attenuators

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Details

357 74, 357 79, H01P 100

Patent

active

039434699

ABSTRACT:
A mount for a microwave diode package wherein good thermal contacts, as well as radio frequency contacts to a microstrip circuit are achieved by applying a mechanical force to a face of the mount at an acute angle so that forces are produced along both of the major axes of the mount.

REFERENCES:
patent: 3731160 (1973-05-01), Klein
patent: 3801882 (1974-04-01), Ward

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