Process to mechanically and plastically deform solid ductile met

Details Process to mechanically and plastically deform solid ductile met Process to mechanically and plastically deform solid ductile met

1991-06-20

1991-12-17

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437189, 437197, 437225, 156645, H01L 2144

Patent

active

050735187

ABSTRACT:
A method of forming a conductive via plug or an interconnect line, or both, of solid ductile metal within an integrated circuit using plastic deformation of the solid metal, and a dry polishing method of removing excess metal from a metal layer atop an underlying layer on a semiconductor substrate wafer. The process begins with a wafer having a dielectric layer, the upper surface of which has been planarized. If both conductive via plugs and interconnect lines are both required within the circuit, a first masking step defines the interconnect lines. A first etch creates channels in the interconnect line locations. A second masking step defines the vias. A second etch creates the vias which pass through the dielectric layer to conductive regions below where contact is to be made. A layer of solid ductile metal is then deposited on top of the dielectric layer. Using a disk or pad which is held in contact with the ductile metal layer, metal of the ductile layer is mechanically worked to plastically deformed more deeply into the channels and vias. The wafer is then dry polished with a solid material having a hardness which is less than both the hardness of the metal and the hardness of the underlying layer to provide remaining metal from the metal layer which is only in conductive interconnect lines or vias.

REFERENCES:
patent: 2767287 (1956-10-01), Kahan
patent: 3778684 (1973-12-01), Fischer et al.
patent: 4569876 (1986-02-01), Nakakita
patent: 4574467 (1986-03-01), Halfacre et al.
patent: 4879258 (1989-11-01), Fisher
C. H. Scrivner, Jr., "Polishing Technique to Remove Al Lands from Semiconductor Chips," IBM Technical Disclosure Bulletin, vol. 24, No. 4, Sep. 1981, p. 2138.

Affiliated with

Also associated with

Rating

Process to mechanically and plastically deform solid ductile met does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process to mechanically and plastically deform solid ductile met, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process to mechanically and plastically deform solid ductile met will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-835477