Semiconductor integrated circuit device

Details Semiconductor integrated circuit device Semiconductor integrated circuit device

1988-01-19

1990-05-01

Hille, Rolf

357 70, 357 80, 357 75, H01L 2314, H01L 2310, H01L 2336, H01L 2352

Patent

active

049223240

ABSTRACT:
A semiconductor integrated circuit device has a package base and a cavity formed with a ground electrode layer thereon. A semiconductor integrated circuit chip is providing on the ground electrode layer. De-coupling capacitors are providing on the surface of the cavity. A ground metal plate and outer leads are formed on the surface of the bottom of the package base. A metal connector is providing through the package base to connect electrically and thermally, the ground electode layer and the ground metal plate.

REFERENCES:
patent: 4551747 (1985-11-01), Gilbert et al.
patent: 4611882 (1986-09-01), Ushida
patent: 4667219 (1987-05-01), Lee et al.
patent: 4705917 (1987-11-01), Gates, Jr. et al.
Pengue et al., "The Quick-Chip A Depletion Mode Digital/Analog Arrays," GaAs IC Symposium Technical Digest, pp. 27-30, 1984.

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