Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1991-09-13
1993-08-24
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361729, 257686, 437209, H05K 700, H01L 2300
Patent
active
052394476
ABSTRACT:
An electronic device packaging structure is described wherein an electronic device is electrically connected to a substrate wherein the electronic device subtends a non-normal angle with respect to the substrate. In a more specific embodiment, a plurality of electronic devices are stacked at offset with respect to each other to expose contact locations on the surface of each electronic device at an edge of each electronic device to form a stepped surface exposing a plurality of electronic device contact locations. This surface is disposed against a substrate having a plurality of contact locations thereon. The electronic device contact locations can be electrically interconnected to the substrate contact locations by solder mounds or alternatively by a cylindrical shaped elastomeric body having metallization bands with a spacing corresponding to the electronic device contact locations. The elastomeric body is pressed between the edge of the stacked electronic devices having the contact locations thereon and substrate surface to form electrical interconnections between electronic device contact locations and substrate contact locations through the electrically conducting bands. The stacked electronic devices can be thermally connected to a heat dissipation member. The stacked electronic devices can have a stepped surface embodying an enhanced area for transfer of heat from the electronic device stack to the heat dissipation member.
REFERENCES:
patent: 3105869 (1963-10-01), Branch et al.
patent: 3748479 (1973-07-01), Lehovec
patent: 3769091 (1973-10-01), Leinkram et al.
patent: 3904933 (1975-08-01), Davis
patent: 4208698 (1980-06-01), Narasimhan
patent: 4266282 (1981-05-01), Henle et al.
patent: 4296456 (1981-10-01), Reid
patent: 4351706 (1982-09-01), Chappell et al.
patent: 4417392 (1983-11-01), Ibrahim
patent: 4426689 (1984-01-01), Henle et al.
patent: 4437235 (1984-03-01), McIver
patent: 4451845 (1984-05-01), Philofsky
patent: 4500905 (1985-02-01), Shibata
patent: 4525921 (1985-07-01), Carson et al.
patent: 4528530 (1985-07-01), Ketchen
patent: 4617160 (1986-10-01), Belanger et al.
patent: 4646128 (1987-02-01), Carson et al.
patent: 4706166 (1986-11-01), Go
patent: 4764846 (1988-08-01), Go
patent: 4897708 (1990-01-01), Clements
patent: 4956746 (1990-09-01), Gates, Jr. et al.
patent: 4959749 (1990-09-01), Dzarnoski, Jr. et al.
patent: 4984064 (1991-01-01), Teshio et al.
patent: 4992908 (1991-02-01), Solomon
patent: 5019943 (1991-05-01), Fassbender et al.
patent: 5019946 (1991-05-01), Eichelberger et al.
patent: 5092782 (1992-03-01), Beaman
patent: 5103247 (1992-04-01), Sugano et al.
"Pursuing 3-D Packages" by M. F. Suer, Elec. Eng. Times, pp. 66, Jan. 21, 1991.
"3-D Interconnection for Ultra-Dense Multichip Packages", C. Val and T. Lemoine (Thomson CSF), IEEE Trans. CHMFT, 13, Dec. 1990.
J. B. Gillett, "Inexpensive Chip Package", vol. 33, No. 1A, Jun. 1990, IBM Technical Disclosure Bulletin, pp. 272-273.
IBM TDB, vol. 19, Jun. 1976, p. 372, "Fabrication of Multiprobe Miniature Electrical Connector", W. Anacker, E. Bassous et al.
IBM TDB, vol. 18, Mar. 1976, "Solder Bonding of Silicon Chips with Through Holes", L. Kuhn and R. Lane.
IBM TDB, vol. 20, Apr. 1978, "Vertical Chip Packaging", R. Henle.
IBM TDB, vol. 21, Dec. 1978, "Edge-Connected Chip Carrier", A. Johnson, IBM.
IBM TDB, vol. 14(9), 2561 (1972) "Bubble Domain Three-Dimensional Magneto-Optic Memory", H. Chang, IBM.
Cotues Paul W.
Moskowitz Paul A.
Murphy Philip
Ritter Mark B.
Walker George F.
International Business Machines - Corporation
Morris Daniel P.
Picard Leo P.
Sparks D.
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