Semiconductor transducer packaged assembly

Details Semiconductor transducer packaged assembly Semiconductor transducer packaged assembly

1977-11-18

1978-12-12

Woodiel, Donald O.

Measuring and testing

Fluid pressure gauge

Diaphragm

73517R, 338 2, 338 42, 73767, 73777, G01L 906

Patent

active

041290429

ABSTRACT:
A semiconductor transducer chip is flip-chip bonded to a semiconductor interface chip, which is mounted on the ceramic package. Thermal coupling between the package and the transducer chip is minimized by the small contact area between the transducer chip and interface chip. Micron size spacing between the spring membrane in the transducer chip and the interface chip produces squeeze film damping of the spring membrane.

REFERENCES:
patent: 4050049 (1977-09-01), Youmans
patent: 4071838 (1978-01-01), Block

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