Facsimile and static presentation processing – Facsimile – Specific signal processing circuitry
Patent
1989-03-06
1990-05-01
Lee, John D.
Facsimile and static presentation processing
Facsimile
Specific signal processing circuitry
358302, 346155, G02B 608, H04N 121, G01D 1506
Patent
active
049213164
ABSTRACT:
An intgeral printhead includes a single fiber optic faceplate substrate to which are connected light emitting diode arrays, driver circuits for selectively controlling the energization of the light emitting diodes and interconnecting conductive lines all disposed on the same fiber optic faceplate substrate which thereby provides the optical lens system for the light emitting diodes and a supporting substrate to which the active components are mounted and electrically interconnected by the conductive lines.
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A New LSI Bonding Technology, "Micron Bump Bonding Assembly Technology", by K. Hatada et al., 5th IEEE/CHMT International Electronic Manufacturing Technology Symposium-Design-to-Manufacturing Transfer Cycle, Proceedings Date: 10-12 Oct. 1988, pp. 23-27.
New Technology, "Insulation Resin Bonding-Chip on Substrate Assembly Technology", by Kenzo Hatada et al., Semiconductor Research Center, Matsushita Electric Industrial Co., Ltd.
Burger Robert J.
Cook Lee M.
Fantone Stephen D.
Rockney Bennett H.
Galileo Electro-Optics Corporation
Lee John D.
Polaroid Corporation
Roman Edward S.
Ullah Akm
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