Method of fabricating an electronic circuit including an apertur

Metal working – Method of mechanical manufacture – Electrical device making

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29830, 174 685, H05K 334

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active

045205612

ABSTRACT:
An electronic circuit including a substrate with an aperture therethrough is manufactured by cutting one or more slots in an edge of a slab of substrate, metalizing the slotted edge of the substrate and metalizing a mating edge of a mating substrate, securing together the metalized edges of the slotted substrate and mating substrate to create an aperture through the substrate from an upper surface to a lower surface thereof and creating a printed circuit pattern on one of the upper and lower surfaces of the combined substrate and metalizing the other surface of the combined substrate including a connection to the metalized edges.

REFERENCES:
patent: 2926340 (1960-02-01), Blain et al.
patent: 3077658 (1963-02-01), Wharton
patent: 3185947 (1965-05-01), Freymodsson
patent: 3281627 (1966-10-01), Fetterrolf et al.
patent: 3326645 (1967-06-01), Counts et al.
patent: 3352730 (1967-11-01), Murch, Jr.
patent: 3357856 (1967-12-01), Ragan et al.
patent: 3964087 (1976-06-01), Mallon
patent: 4208080 (1980-06-01), Teagno
patent: 4372046 (1983-02-01), Suzuki
IBM Tech. Discl. Bulletin vol. No. 15, Dec. 1972, pp. 2183-2184, by Warwick.

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