Cover for a semiconductor package

Details Cover for a semiconductor package Cover for a semiconductor package

1986-04-09

1987-12-22

Pellinen, A. D.

Electricity: electrical systems and devices

Miscellaneous

361395, 174 52FP, 357 80, 357 51, 357 75, H05K 503

Patent

active

047149817

ABSTRACT:
A cover for a semiconductor package includes a composite layer on its upper most surface containing a passive circuit. The passive circuit may include a number of passive components to fulfill various functions such as capacitive coupling and decoupling, resistive pull-up and pull-down, et al. Appropriate terminal points of the passive circuit terminate in contacts which are disposed on the top surface of the composite layer. Terminals are attached to the contacts for interconnecting the passive circuit with terminal leads of the semiconductor package or other circuit components.

REFERENCES:
patent: 3349481 (1967-10-01), Karp
patent: 3374400 (1968-03-01), Tabuchi et al.
patent: 4249196 (1981-02-01), Durney
patent: 4342069 (1982-07-01), Link
patent: 4454529 (1984-06-01), Philofsky et al.
patent: 4539622 (1985-09-01), Akasaki
patent: 4598307 (1986-07-01), Wakabayashi et al.
patent: 4639826 (1987-01-01), Val et al.
Decoupling II, AVX Ceramics.

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