Method of electrochemical mechanical planarization

Details Method of electrochemical mechanical planarization Method of electrochemical mechanical planarization

1997-03-26

1998-09-15

Rose, Robert A.

Abrading

Abrading process

Glass or stone abrading

451 5, 451 60, 451286, B24B 100

Patent

active

058071652

ABSTRACT:
A method of planarizing a layer of a workpiece such as a semiconductor wafer includes rotating the layer against an electrolytic polishing slurry and flowing an electrical current through the slurry and through only one major side and/or minor sides of the layer, to remove portions of the layer. The one major side carries no microelectronic components which might be damaged by the current. At least a part of each step of rotating and of flowing occurs simultaneously. An apparatus for planarizing a layer includes a rotatable workpiece carrier, a rotatable platen arranged proximately to the carrier, a polishing pad mounted on the platen, and workpiece electrodes. The workpiece electrodes are movably attached to the carrier so as to engage electrically the minor sides of a layer when a workpiece is held on the carrier.

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