Photopolymerizable adhesive composition

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Compositions to be polymerized by wave energy wherein said...

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522 48, 522172, 522182, 522 40, 522 41, C08F 250, C09J 402

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active

058831479

ABSTRACT:
A photopolymerizable adhesive consisting of Compound (1) which contains at least one (meth)acryloxy group as a polymerizing group in its molecule, and other structures constructed from the group(s) selected from the group consisting of alkyl group, alkyloxy group, polyalkoxy group, siloxanyl group and the substituted group thereof substituted by fluorine, hydroxy or alkoxy group; Compound (2) selected from (meth)acrylic acids, hydroxyalkyl (meth)acrylates, (meth)acryloxyalkyl succinic acids, trialkoxyvinyl silanes and .gamma.-(meth)acryloxyalkyl trialkoxy silanes; and Compound (3) selected from hydroxyacetophenones, acetophenones, glyoxy esters and camphorquinones, wherein said adhesive comprises 3 to 60 wt % of the compound (2), and 0.1 to 2 wt % of the Compound (3).

REFERENCES:
patent: 4272586 (1981-06-01), Ando et al.
patent: 4317862 (1982-03-01), Honda et al.
patent: 4379201 (1983-04-01), Heilmann et al.
patent: 4906675 (1990-03-01), Inagaki et al.
patent: 5288827 (1994-02-01), Li et al.
Derwent Week 8434 AN 84-210532 & JP-A-59 122 567 Matsushita Elec Ind. Abstract.

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