Semiconductor package having leads that break-away from supports

Details Semiconductor package having leads that break-away from supports Semiconductor package having leads that break-away from supports

1990-01-29

1991-01-29

Hille, Rolf

357 70, H01L 2348, H01L 2354

Patent

active

049890697

ABSTRACT:
A semiconductor package wherein a semiconductor die is disposed in packaging material and electrically coupled to leads having portions extending from the packaging material. The portions of the leads that extend from the packaging material are adhered to the outside of the packaging material and release therefrom when subjected to a predetermined amount thermal stress. The invention disclosed herein allows consistent alignment of flexible leads while adequately reducing stress caused by the differing coefficients of thermal expansion of the semiconductor package and a printed circuit or the like on which the package is mounted.

REFERENCES:
patent: 3842189 (1974-10-01), Southgate
patent: 4465898 (1984-08-01), Orcutt et al.
patent: 4672421 (1987-06-01), Lin
patent: 4724280 (1988-02-01), Tsuji et al.
patent: 4794446 (1988-12-01), Hamano
patent: 4872047 (1989-10-01), Fister et al.

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