Semiconductor package

Details Semiconductor package Semiconductor package

1990-01-23

1991-01-29

Hille, Rolf

357 70, 357 74, H01L 2348, H01L 2354

Patent

active

049890662

ABSTRACT:
A semiconductor package has feed leads each having a pair of recesses to form two pairs of legs.

REFERENCES:
Nikkei Electronics-Japanese Publications Document Dec. 30, 1985 (p. 61) Fig. 2.

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