Semiconductor device with plastic material covering a semiconduc

Details Semiconductor device with plastic material covering a semiconduc Semiconductor device with plastic material covering a semiconduc

1995-07-21

1998-10-06

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257695, 257701, 257703, 257705, 257706, 257796, H01L 2331, H01L 2312, H01L 2314

Patent

active

058181059

ABSTRACT:
A plastic covered semiconductor device that enables to simplify the structure and fabrication to reduce the assembly cost of the device and to reduce the thickness or height of the device. This device contains a substrate having a first surface and a second surface opposite to the first surface, a semiconductor chip mounted on or over the first surface, lead fingers joined to the first surface, interconnecting conductors electrically interconnecting the semiconductor chip with the corresponding lead fingers, respectively, and a plastic covering material formed to cover the first surface. Each lead finger is made of an inner part bonded to the first surface of the substrate and an outer part protruding the covering material. The covering material confines the semiconductor chip, the interconnecting conductors and the inner parts of the lead fingers. The second surface of the substrate is exposed from the covering material. An edge of the covering material is substantially in accordance with an edge of the first surface. The substrate acts as a top or bottom of a package of the device.

REFERENCES:
Shinko Electric Industries Co., Ltd., "Hyper-Quad" (Metal Core PCB QFP), Aug. 1993, 2 pages.

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