Method of applying a security element to a substrate

Details Method of applying a security element to a substrate Method of applying a security element to a substrate

1996-03-13

1999-03-16

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156239, 156240, 156247, 1562728, 1562753, 156290, B32B 3104, B44C 117

Patent

active

058824634

ABSTRACT:
In a method of transferring a security element which is in the form of a laminate with a carrier foil and with a thermally activatable adhesive layer for connection to a substrate onto a document the adhesive layer is brought into contact with the substrate and locally heated by the supply of heat energy through the laminate. After the adhesive layer cools if necessary the carrier foil can be pulled off the substrate, in which case the carrier foil, at the locations adhering to the substrate, is detached from the rest of the laminate and the laminate tears along the boundary between the adhering and the non-adhering locations so that only the adhering locations of the laminate remain behind on the substrate. In particular a laser beam or an array of laser or light emitting diodes is suitable for the supply of heat energy. The laminate preferably has diffraction structures or layers producing optical interference effects. The alignment of the laminate and the substrate can be effected in accurate register relationship.

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