Wire bonds and electrical contacts of an integrated circuit devi

Details Wire bonds and electrical contacts of an integrated circuit devi Wire bonds and electrical contacts of an integrated circuit devi

1987-05-13

1988-09-13

Edlow, Martin H.

357 68, 357 69, 357 70, H01L 3902

Patent

active

047713305

ABSTRACT:
An integrated circuit devicer package includes a rigid frame and flexible tape assembly having wire leads between the die attach pad, conductive lead fingers, and the I.C. chip. A dam structure prevents resin flow to ensure proper wire bonding and a wedge prevents electrical shorting. A recognition pattern enables precise wire bonding. A epoxy molding compound is interposed in cavities formed in a Kapton layer to preclude delamination.

REFERENCES:
patent: 4479298 (1984-10-01), Hug
patent: 4496965 (1985-01-01), Orcutt et al.
patent: 4663650 (1987-05-01), Gilder, Jr. et al.
patent: 4672421 (1987-06-01), Lin
patent: 4701781 (1987-10-01), Sankhagowit

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