Pressure sensitive adhesive composition and sheet having layer t

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Compositions to be polymerized by wave energy wherein said...

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522 96, 522117, 428343, 428345, 428355EN, 428355N, 528 75, C08G 1862

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active

059555122

ABSTRACT:
A pressure sensitive adhesive composition is disclosed which comprises an acrylic copolymer (A), an energy beam polymerizable urethane acrylate oligomer (B) and an energy beam polymerizable compound having one acryloyl group or methacryloyl group in each molecule thereof (C). This composition is preferred to further contain a plasticizer (D), a crosslinking agent (E) and/or a photopolymerization initiator (F) according to necessity. The pressure sensitive adhesive composition has satisfactory pressure sensitive adherence and initial adhesion before the irradiation with energy beam and the adhesive strength thereof is sharply reduced with maintaining the rubber elasticity after the irradiation with energy beam. Further, the pressure sensitive adhesive composition ensures excellent chip alignability in the expanding step subsequent to dicing. The pressure sensitive adhesive composition provides a pressure sensitive adhesive sheet, especially, a wafer processing pressure sensitive adhesive sheet or a surface protective pressure sensitive adhesive sheet.

REFERENCES:
patent: 5747551 (1998-05-01), Lewandawski et al.

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