Metal fusion bonding – Process – Plural joints
Patent
1988-06-23
1989-06-27
Godici, Nicholas P.
Metal fusion bonding
Process
Plural joints
228253, 228255, 228 41, 228 563, B23K 3514
Patent
active
048421847
ABSTRACT:
A method of applying solder to contacts of a connector, when the contacts are spaced apart according to a given arrangement. The method includes the steps of perforating a water-soluble adhesive material to form perforations in a pattern according to the given arrangement, applying solder preforms around the perforations, positioning the adhesive material to center the solder preforms around the contacts, washing off the adhesive material with water, and heating the contacts to the flow-point temperature of the solder.
REFERENCES:
patent: 2913634 (1959-11-01), Scoville
patent: 2977562 (1961-03-01), Benson
patent: 3396894 (1968-08-01), Ellis
patent: 3569607 (1971-03-01), Martyak et al.
patent: 3591922 (1971-07-01), Pardee
patent: 3932934 (1976-01-01), Lynch et al.
patent: 4209893 (1980-07-01), Dyce et al.
patent: 4216350 (1980-08-01), Reid
patent: 4354629 (1982-10-01), Grassauer et al.
patent: 4449769 (1984-05-01), Kobayashi et al.
patent: 4484704 (1984-11-01), Grassauer et al.
patent: 4551914 (1985-11-01), Stiggelbout
patent: 4641426 (1987-02-01), Hartman et al.
patent: 4663815 (1987-05-01), Hartman et al.
patent: 4705205 (1987-11-01), Allen et al.
3M, New Mask Plus II Water Soluble Wave Solder Tape, 1986.
Godici Nicholas P.
Heinrich Samuel M.
LTV Aerospace & Defense Company
LandOfFree
Method and apparatus for applying solder preforms does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for applying solder preforms, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for applying solder preforms will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-806711