Micro-surface welding

Details Micro-surface welding Micro-surface welding

1976-12-17

1979-10-16

Truhe, J. V.

Electric heating

Metal heating

Wire, rod, or bar bonding

219 912, 219113, 219119, B23K 1100

Patent

active

041714776

ABSTRACT:
This invention relates to a method and apparatus for wire bonding a variety of metals in the interconnection of semiconductor chips to electronic package substrate circuitries. A pair of electrically conducting bonding tip members are provided which are electrically isolated from one another and which are constructed of a material having a high resistivity. The wire is positioned beneath the tip members and a load is applied to the members to force the wire against a land on the substrate. A voltage source is provided to apply a voltage between the tip members. Activitation of the voltage source results in current flow through the tips and through the wire, in series, causing heating of the tip members and of the section of wire beneath them. Diffusion bonding will initiate before a significant amount of oxidation has had time to occur.

REFERENCES:
patent: 2160659 (1939-05-01), Hensel
patent: 3263057 (1966-07-01), Conti
patent: 3263059 (1966-07-01), Rzant
patent: 3297855 (1967-01-01), Bowers
patent: 3320401 (1967-05-01), Zachry et al.
patent: 3342972 (1967-09-01), Penberg
patent: 3435184 (1969-03-01), Schroeppel et al.
Charles D. Hodgman, M. S., ed. "Handbook of Chemistry and Physics", 28th edition, 1944, pp. 1880-1882.
"Stored Energy Welding (cont'd)", EDN, 12/1965.
"ABC's of Stored Energy Welding, Part II", EDN, 1/1966.

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