Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1983-06-24
1988-09-13
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
361393, H01R 909
Patent
active
047706406
ABSTRACT:
An electrical interconnection device provides electrical connection between any two or more microelectronic layers in a multilayer microelectronic device, or between the layers and an external electrical device. The electrical interconnection device is a monolithic integrated circuit with a pattern of conductive paths fabricated on its surface, and is placed directly against the side edges of a multilayer microelectronic device such that the paths on the electrical interconnection device contact associated conductive pathways exposed at the side edges of the layers of the microelectronic structure.
REFERENCES:
patent: 2995686 (1961-08-01), Selvin
patent: 3219886 (1965-11-01), Katzin
patent: 3243661 (1966-03-01), Ullery, Jr.
patent: 3403300 (1968-09-01), Horowitz et al.
patent: 3761858 (1973-09-01), Oka
patent: 4076357 (1978-02-01), Cistola
patent: 4202007 (1980-05-01), Dougherty et al.
patent: 4250536 (1981-02-01), Barringer et al.
patent: 4252991 (1981-02-01), Iwabushi
patent: 4283755 (1981-08-01), Tracy
patent: 4336088 (1982-06-01), Hetherington et al.
patent: 4357647 (1982-10-01), Hadersbeck et al.
patent: 4502098 (1985-02-01), Brown et al.
IBM Bulletin, Coombs, vol. 16, No. 3, p. 945, 8-1973.
IBM Bulletin, Agusta et al, vol. 10, No. 7, pp. 890-891, 12-1967.
State of the Art, published 1983.
"Scientific American", Oct. 1982.
RCA Technical Notes, TN No. 1316, "Universal Test Fixture for Testing Chip Carriers" by Robert Lindsey Schelborn.
Scientific American, Jul. 1983, "Microelectronic Packaging" by Albert J. Blodgett, Jr.
Paul C. Michaelis and Peter I. Bonyhard, IEEE Transactions on Magnetics, vol. Mag-9, No. 3, Sep. 1973, Magnetic Bubble Mass Memory-Module Design and Operation.
VLSI Technologies, 1982, published by IEEE, p. 319.
Science Digest, Dec. 1985, p. 9, by Stephen Solomon.
Science Digest, Dec. 1985, p. 44.
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