Method for microelectronic device packaging employing capacitive

Details Method for microelectronic device packaging employing capacitive Method for microelectronic device packaging employing capacitive

1991-12-06

1993-05-18

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

29 2535, 29594, 437211, 437212, 437209, 437915, H01L 2156, H01L 2158, H01L 2160

Patent

active

052121151

ABSTRACT:
A method for microelectronic device encapsulation is described comprising steps of providing a microelectronic device (e.g., a surface acoustic wave device) having interconnection contacts disposed thereon and depositing a passivation layer over the microelectronic device and the interconnection contacts. The method further comprises steps of providing alternating current coupled electrodes positioned on the passivation layer and over the interconnection contacts, providing a base substrate (including pressure contact electrodes and vias) and bonding the base substrate to the microelectronic device with a bonding agent for providing a mechanical bond between the microelectronic device and the base and for providing a hermetically sealed environment for the microelectronic device. The method further comprises providing electrical coupling between the pressure contact electrodes and the alternating current coupled electrodes. This method realizes compact microelectronic device packages which can be mass produced from entire microelectronic device substrate.

REFERENCES:
patent: 4181564 (1980-01-01), Fogarty et al.
patent: 4612083 (1986-09-01), Yasumoto et al.
patent: 4736128 (1988-04-01), Takoshima et al.
patent: 4737742 (1988-04-01), Takoshima et al.

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