Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1996-06-18
1997-12-02
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257707, 257737, H01L 2310
Patent
active
056939809
ABSTRACT:
A ball-grid-array-type semiconductor device has upper signal interconnections (1a) and a semiconductor element mounting pad (4) disposed on an upper surface of a glass epoxy substrate (7), and four extension patterns (5) extending from the semiconductor element mounting pad (4) to respective four corners of the glass epoxy substrate (7). The upper signal interconnections (1a) are connected by via-holes (2) to lower signal interconnections (1b) disposed on a lower surface of the glass epoxy substrate (7). A semiconductor element (10) is mounted on the semiconductor element mounting pad (4) and has electrodes (3) connected to the upper signal interconnections (10) by thin metal wires (11). The semiconductor element (10) mounted on the semiconductor element mounting pad (4) is sealed by a molding resin layer (9). Solder balls (3) are fused to the lower surface of the glass epoxy substrate (7) and connected to the lower signal interconnections (1b). The extension patterns (5) connected to the semiconductor element mounting pad (4) provides an increased heat radiation capability to dissipate heat generated by the semiconductor element (10). When the ball-grid-array-type semiconductor device is mounted on a circuit substrate (7), humidity absorbed therein is discharged along the extension patterns (5), thereby preventing the glass epoxy substrate (7) and the molding resin layer (9) from being peeled off each other.
REFERENCES:
patent: 5572405 (1996-11-01), Wilson et al.
NEC Corporation
Potter Roy
Thomas Tom
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