Apparatus for cutting wafer shell valves

Details Apparatus for cutting wafer shell valves Apparatus for cutting wafer shell valves

1986-10-29

1988-09-13

Yost, Frank T.

Solid material comminution or disintegration

Apparatus

Including means applying fluid to material

2411012, 409137, B02C 2320

Patent

active

047703512

ABSTRACT:
In order to cut out half-shells formed in a wafer sheet in which the half-shells are interconnected by a substantially flat web, the wafer sheet is advanced against an array of disc saws the discs of which lie in a single plane parallel to the general plane of the wafer sheet and the centers of which are aligned in a direction perpendicular to the direction of advance of the wafer sheet itself.

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