Method of producing a printed circuit board

Details Method of producing a printed circuit board Method of producing a printed circuit board

1991-07-22

1993-05-18

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174262, 427 97, 430319, H01K 310

Patent

active

052109402

ABSTRACT:
A method of manufacturing a printed circuit board comprises providing an insulating substrate having opposed major sides, forming a through-hole between the two sides of the insulating substrate, forming a conductive land on both sides of the insulating substrate surrounding the ends of the through-hole, forming margining frames at the outer peripheries of the conductive lands, and packing conductive paste into the through-hole after the formation of the margining frames. The margining frames extend vertically beyond the height of the conductive lands and prevent the conductive paste from spreading outwardly beyond the outer peripheries of the conductive lands.

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IBM Tech. Discl. Bull. vol. 12, No. 8, Jan. 1970, pp. 1272-1273 by M. M. Haddad et al.

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