Method of assembling an electronic part device

Metal working – Method of mechanical manufacture – Electrical device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29832, 156 85, 156276, 264230, 361400, H05K 334

Patent

active

052109380

ABSTRACT:
In a method of assembling an electronic part device and a circuit board, an electrode formed on the electronic part device and a conductive pattern formed on the circuit board so as to be opposite to the electrode are positioned, and a thermosetting resin sheet including a thermally shrinkable particle and provided between the electronic part device and the circuit board is hardened and shrunk.

REFERENCES:
patent: 4208005 (1980-06-01), Nate et al.
patent: 4774634 (1988-09-01), Tate et al.
patent: 4864471 (1989-09-01), Hargasser et al.
patent: 5162613 (1992-11-01), Schoenthaler

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of assembling an electronic part device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of assembling an electronic part device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of assembling an electronic part device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-796947

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.