Semiconductor device

Details Semiconductor device Semiconductor device

1988-08-23

1990-03-20

Hille, Rolf

357 74, H01L 2336, H01L 2306, H01L 2314

Patent

active

049105841

ABSTRACT:
A semiconductor device including a semiconductor chip, a leadless chip carrier to one side of which the chip is adhered, and a cap which seals the leadless chip carrier to protect the semiconductor chip. A heat sinking plate (21a or 21b) which is electrically connected to the semiconductor chip (8) is provided on the opposite side of the leadless chip carrier (1).

REFERENCES:
patent: 3663868 (1972-05-01), Noguchi et al.
patent: 3699402 (1972-10-01), McCann et al.
patent: 3801881 (1974-04-01), Anazawa
patent: 3972062 (1976-07-01), Hopp
patent: 4025997 (1977-05-01), Gernitis et al.
patent: 4383270 (1983-05-01), Schelhorn
patent: 4445274 (1984-05-01), Suzuki et al.
patent: 4541003 (1985-09-01), Otsuka et al.
"Wrap Around Heat Sink"-Bond et al-IBM Technical Disclosure, pp. 1434-1435, Sep. 1977.
"Chip Heat Sink Package Assembly"-Johnson et al-IBM Tech. Disclosure-Mar. 1970, vol. 12, No. 10, p. 1665.

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