Microchannel cooling using aviation fuels for airborne electroni

Details Microchannel cooling using aviation fuels for airborne electroni Microchannel cooling using aviation fuels for airborne electroni

1996-07-22

1997-12-02

Rivell, John

Heat exchange

With retainer for removable article

Electrical component

16510433, 257714, 361699, F28F 700

Patent

active

056925581

ABSTRACT:
Aviation fuel is used as the coolant for a microchannel heat sink for airborne electronics. The use of preexisting aviation fuel as a coolant medium eliminates the weight, size and expense of a separate liquid system dedicated solely to electronics cooling. The heat sink is comprised of a body of material having high thermal conductivity and in which are formed a set of parallel closed-ended microchannels on the order of 0.001 in. by 0.004 in. separated by a distance of 0.001 in.

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A.H. Johnson, Integrally Groove Semiconductor Chip and Heat Sink, Oct. 1971, p. 1425.

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