Process for the production of metallized semiconductors

Details Process for the production of metallized semiconductors Process for the production of metallized semiconductors

1983-01-13

1984-09-18

Weisstuch, Aaron

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427438, 4274431, 427305, 136256, 29572, 357 65, H01L 3118

Patent

active

044724586

ABSTRACT:
The firmly adhesive metallization, in particular partial metallization, of the surface of semiconductors is possible, without pickling, by carrying out the activation with organometallic compounds of metals of the IB and VIIIB Groups of the Periodic Table of Elements, then reducing in a conventional manner and metallizing without current.

REFERENCES:
patent: 3523038 (1970-08-01), Sanders
patent: 3890455 (1975-06-01), Ballas et al.
patent: 4359487 (1982-11-01), Schneider
"Low Resistance Contacts for GaAlAs/GaAs Cells", NASA Tech. Briefs, Winter 1977, p. 433.
L. A. Grenon et al., "Reliability of Silicon Solar Cells With a Plated Ni-Cu Metallization System", Conf. Record, 15th IEEE Photovoltaic Specialists Conf. (1981), pp. 522-526.
C. Flores, "Low Cost Process for Ohmic Contacts on GaAs/Ga.sub.1-x Al.sub.x As Concentrator Solar Cells", Solar Cells, vol. 9, pp. 169-177 (1983).
Periodic Table of the Elements, Sargent-Welch Scientific Co., Chicago, Ill. (1968).

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