Epoxy resin composition and semiconductor devices encapsulated t

Details Epoxy resin composition and semiconductor devices encapsulated t Epoxy resin composition and semiconductor devices encapsulated t

1992-05-20

1994-03-29

Krass, Frederick

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523466, 525476, 525481, 525482, 525487, 525534, 528 97, 257787, C08G 5922, C08L 6300

Patent

active

052985482

ABSTRACT:
An epoxy resin composition comprising (A) a naphthalene ring-containing epoxy resin, (B) a biphenyl-containing epoxy resin, (C) a specific phenolic resin, and (D) an inorganic filler shows good flow and cures to products having low modulus of elasticity, especially at temperatures above Tg, a low coefficient of expansion, high Tg irrespective of low stresses, and minimized water absorption. Then semiconductor devices encapsulated with the present composition remain highly reliable even after being subject to thermal shocks upon surface mounting.

REFERENCES:
patent: 3384618 (1968-05-01), Imoto et al.
patent: 4551508 (1985-11-01), Urasaki
patent: 4859722 (1989-08-01), Shiobara et al.
patent: 4877822 (1989-10-01), Itoh et al.
patent: 5068293 (1991-11-01), Kaji et al.
patent: 5190995 (1993-03-01), Shiobara et al.
English language translation of Japanese Kokai 63-251419 (Oct. 18, 1988).

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