Conditioning of a substrate for electroless plating thereon

Details Conditioning of a substrate for electroless plating thereon Conditioning of a substrate for electroless plating thereon

1990-11-13

1994-06-07

Beck, Shrive

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

427304, 427305, 4274431, B05D 100

Patent

active

053188039

ABSTRACT:
A dielectric substrate is conditioned for subsequent electroless plating thereon by contacting with a catalytic metal salt and then with a reducing agent and with an electroless metal plating bath followed by contacting with a second catalytic metal salt. In addition, a dielectric substrate is conditioned for electroless plating thereon by obtaining a substrate of a dielectric material that contains metal particles therein and contacting with a catalytic metal salt.

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Kirk-Othmer "Encyclopedia of Chemical Technology" vol. 8, 1979 J. Wiley & Sons, p. 859.

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