Substrate for packaging a semiconductor device

Details Substrate for packaging a semiconductor device Substrate for packaging a semiconductor device

1992-12-18

1994-03-29

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437184, 437203, 437208, 437209, H01L 2144

Patent

active

052984605

ABSTRACT:
A substrate for packaging a semiconductor device having a bump thereon according to the present invention is characterized by that the substrate has an electrode terminal to which the bump is to be connected, the electrode terminal has a recess formed thereon to the receive at least a top of the bump, and at least a top of the surface of the electrode terminal is covered by a metal layer having a lower melting point than that of the bump.

REFERENCES:
patent: 4930001 (1990-05-01), Williams
patent: 5071787 (1991-12-01), Mori et al.
patent: 5074947 (1991-12-01), Estes et al.
patent: 5156997 (1992-10-01), Kumar et al.

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