Method of selectively monitoring trace constituents in plating b

Details Method of selectively monitoring trace constituents in plating b Method of selectively monitoring trace constituents in plating b

1992-11-13

1994-03-29

Niebling, John

Chemistry: electrical and wave energy

Processes and products

Processes of treating materials by wave energy

204412, 204434, G01N 2726

Patent

active

052981290

ABSTRACT:
A method of selectively monitoring particular trace constituents within a plating bath containing multiple trace constituents. The method provides improved selectivity over known voltammetric techniques for certain plating baths and trace constituents. The method involves applying a brief voltammetric plating signal to a pretreated electrode positioned within the plating bath solution, applying a rapid stripping signal to the plated electrode, and monitoring the resultant stripping signal response current. The characteristics of the stripping signal response current indicate the particular trace constituent concentration level. The method complements and is easily integrated with known voltammetric techniques and equipment, and thus improves the efficiency and versatility of existing plating bath analysis systems.

REFERENCES:
Tench, Cyclic Pulse Voltammetric Stripping Analysis of Acid Copper Plating Baths, Apr. 1985, pp. 831-834.

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