Semiconductor device and a fabrication process thereof

Details Semiconductor device and a fabrication process thereof Semiconductor device and a fabrication process thereof

1994-09-08

1996-05-28

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257706, 257780, 257738, H01L 2304

Patent

active

055214355

ABSTRACT:
A semiconductor device includes a package substrate and a semiconductor chip provided on the package substrate, wherein there is provided a jumper substrate carrying thereon electrodes and conductor patterns that connect the electrodes, such that the jumper substrate is mounted upon the package substrate for providing an interconnection between the electrode patterns provided on the upper major surface of the package substrate in electrical connection with the electrode pads on the semiconductor chip and the electrodes that are isolated in correspondence to the through-holes provided on the package substrate.

REFERENCES:
patent: 4721995 (1988-01-01), Tanizawa
patent: 4901136 (1990-02-01), Neugebauer et al.
patent: 5309021 (1994-05-01), Shimamoto et al.
patent: 5357400 (1994-10-01), Takekawa

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