Semiconductor device having improved leads comprising palladium

Details Semiconductor device having improved leads comprising palladium Semiconductor device having improved leads comprising palladium

1994-06-01

1996-05-28

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Of specified material other than copper

257766, 257741, 257768, H01L 23495, H01L 2348, H01L 2352, H01L 2940

Patent

active

055214320

ABSTRACT:
A semiconductor device includes a semiconductor chip, a die-pad on which the semiconductor chip is mounted, a package encapsulating the die pad and the semiconductor chip, and a plurality of leads electrically connected to the semiconductor chip and projecting from the package, wherein each of the leads has a lead body made of pure nickel (Ni) having a purity equal to or greater than 99% and a first film formed thereon, the first film being made of palladium (Pd).

REFERENCES:
patent: 4785137 (1988-11-01), Samuels
patent: 4970569 (1990-11-01), Mori et al.
patent: 4977442 (1990-12-01), Suziki et al.
patent: 5032895 (1991-07-01), Horiuchi et al.
patent: 5066550 (1991-11-01), Horibe et al.
patent: 5175609 (1992-12-01), DiGiacomo et al.
patent: 5221859 (1993-06-01), Kobayashi et al.
07/874,916 Jun. 16, 1986 Casey (5,264,399) IBM.
07/174,060 Mar. 28, 1988 Abbott (FNC).
07/313,769 Aug. 22, 1989 McLellan (ABN5).

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