Metal working – Method of mechanical manufacture – Electrical device making
Patent
1992-10-08
1994-07-05
Echols, P. W.
Metal working
Method of mechanical manufacture
Electrical device making
29846, 29852, 29853, 29745, 156261, 156298, 1563031, H05K 310, H01K 310, B23P 1900
Patent
active
053255836
ABSTRACT:
There is disclosed a method for manufacturing a printed circuit board in which fine copper circuit patterns are transferred onto a thermoplastic resin, without producing a large amount of waste liquors in which copper is dissolved unlike in a subtract method. The method for manufacturing a printed circuit board includes the steps of manufacturing a printed circuit original plate having protruding patterns which have the same shape as circuit patterns to be formed and a height at least the same as the thickness of a copper foil used and each of which is constituted by a flat or projecting curved surface to be brought into contact with the copper foil and side surfaces different from the flat or projecting curved surface, and heating under pressure the protruding patterns of the original plate against a thermoplastic resin with the copper foil interposed therebetween to transfer portions of the copper foil in contact with the protruding patterns onto the surface of the thermoplastic resin, thereby forming the circuit patterns.
REFERENCES:
patent: 2886880 (1959-05-01), Eisler
patent: 4313995 (1982-02-01), Delgadillo
Haddad, M. M. & Walsh, T. J.; IBM Tech. Disclosure Bull. "Mechanically Bonded Printed Circuit"; vol. 2, No. 1; Jun. 1959; p. 9.
Webb, E. J.; Walsh, T. J.; Bolda, F. J.; "Flush Molding of Printed Circuitry"; IBM Tech. Disclosure Bull.; vol. 8, No. 8; Jan. 1966; p. 1025.
Ohta Hideo
Sasaki Osamu
Shimizu Seizaburo
Yoshizumi Akira
Echols P. W.
Kabushiki Kaisha Toshiba
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